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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/27 tsz02201-0h1h0b101570-1-2 ? 2015 rohm co., ltd. all rights reserved. 16.oct.2015 rev.001 www.rohm.com tsz22111 ? 14 ? 001 dc brushless fan motor drivers multifunction single-phase full-wave fan motor driver BD61241FV general description BD61241FV is a 1chip driver that is composed of h-bridge power dmos fet. the pin is compatible with bd61240fv(rotation speed pulse signal output). features ? ssop small package ? driver including power dmos fet ? speed controllable by dc / pwm input ? i/o duty slope adjust ? pwm soft switching ? current limit ? start duty assist ? lock protection and automatic restart ? quick start ? lock alarm signal (al) output applications ? fan motors for general consumer equipment of desktop pc, projector, etc. key specifications ? operating voltage range: 5.5v to 16v ? operating temperature range: -40c to +105c ? output voltage (total): 0.2v(typ) at 0.2a package w(typ) x d(typ) x h(max) 5.00mm x 6.40mm x 1.35mm typical application circuits figure 1. application of pwm input figure 2. application of dc voltage input ssop-b16 pwm m h la out2 h+ h- out1 vcc min lz slope ref rnf soft cs sig al 1 gnd pwm 2 3 15 14 13 12 4 5 6 7 8 11 10 9 16 dc m h la out2 h+ h- out1 vcc min lz slope ref rnf soft cs sig al 1 gnd pwm 2 3 15 14 13 12 4 5 6 7 8 11 10 9 16 datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 pin configuration block diagram pin description i/o truth table hall input driver output h+ hC out1 out2 h l l h l h h l h; high, l; low motor state al rotating l locking hi-z al output is open-drain type. pin no. pin name function 1 al lock alarm signal output terminal 2 hC hall C input terminal 3 h+ hall + input terminal 4 la lead angle function select terminal 5 pwm pwm input duty terminal 6 cs output current detecting terminal 7 out2 motor output terminal 2 8 rnf output current detecting resistor connecting terminal (motor ground) 9 out1 motor output terminal 1 10 vcc power supply terminal 11 ref reference voltage output terminal 12 min minimum output duty setting terminal 13 lz recirculate period setting terminal 14 soft soft switching setting terminal 15 slope i/o duty slope setting terminal 16 gnd ground terminal (signal ground) (top view) pwm la out2 h+ h- out1 v cc min lz slope tsd control logic osc filter ref refe- rence rnf pre- driver soft cs inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 al signal output 1 gnd 16 + - comp comp - + v cl inside reg soft min h+ out2 la h- al vcc ref slope pwm gnd lz rnf 1 2 3 4 5 6 7 15 out1 cs 16 8 14 13 12 11 9 10 v cc v cc downloaded from: http:///
datasheet d a t a s h e e t 3/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limit unit supply voltage v cc 18 v power dissipation pd 0.87 (note 1) w operating temperature range topr -40 to +105 c storage temperature range tstg -55 to +150 c output voltage v o 18 v output current i o 1.2 (note 2) a lock alarm signal (al) output voltage v al 18 v lock alarm signal (al) output current i al 10 ma reference voltage (ref) output current i ref 10 ma input voltage1 (h+,hC,min,cs,la,soft,lz,slope) v in1 3.6 v input voltage2 (pwm) v in2 6.5 v junction temperature tj 150 c (note 1) reduce by 7.0mw/c when operating over ta =25c. (mounted on 70.0mm70. 0mm1.6mm glass epoxy board) (note 2) do not exceed pd. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol limit unit operating supply voltage range v cc 5.5 to 16 v input voltage range1 (h+, hC, min, la, soft, lz, slope) v in1 0 to v ref +0.3 v input voltage range2 (cs) v in2 0 to 1/2 x v ref v input voltage range3 (pwm) v in3 0 to 5 v pwm input duty range d pwm 0 to 100 % pwm input frequency range f pwm 15 to 50 khz downloaded from: http:///
datasheet d a t a s h e e t 4/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=25c, v cc =12v) parameter symbol limit unit conditions reference data min typ max circuit current i cc 3.0 4.5 6.5 ma figure 3 output voltage v o - 0.2 0.35 v i out =200ma, high and low side total figure 4 to figure 7 lock detection on time t on 0.3 0.5 0.7 s figure 8 to figure 10 lock detection off time t off 3.0 5.0 7.0 s hall input hysteresis voltage+ v hys + 7 12 17 mv figure 11 hall input hysteresis voltage- v hys - -5 -10 -15 mv al output low voltage v all - - 0.30 v i al =5ma figure 12 to figure 13 al output leak current i all - - 10 a v al =16v figure 14 pwm input high level voltage v pwmh 2.5 - 5.0 v - pwm input low level voltage v pwml 0.0 - 1.0 v - pwm input current i pwmh -10 0 10 a v pwm =5v figure 15 to figure 16 i pwml -50 -25 -12 a v pwm =0v reference voltage v ref 3.0 3.3 3.6 v i ref =-1ma figure 17 to figure 18 current limit setting voltage v cl 235 265 295 mv figure 19 la input high level voltage v lah 2.5 - 3.3 v - la input low level voltage v lal 0.0 - 1.0 v - la input current i lah -10 0 10 a v la =ref figure 20 i lal -0.47 -0.33 -0.25 ma v la =0v figure 21 cs input bias current i cs -0.4 - - a v cs =0v figure 22 for parameters involving current, positive notation means inflow of current to ic while negative notation means outflow of curr ent from ic. downloaded from: http:///
datasheet d a t a s h e e t 5/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 typical performance curves (reference data) -1.2 -0.9 -0.6 -0.3 0.0 0.0 0.4 0.8 1.2 output source current: i o [a] output high voltage: v oh [v] 0.0 0.3 0.6 0.9 1.2 0.0 0.4 0.8 1.2 output sink current: i o [a] output low voltage: v ol [v] figure 4. output high voltage vs output source current (v cc =12v) figure 3. circuit current vs supply voltage figure 6. output low voltage vs output sink current (v cc =12v) 105c 25c C 40c 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] circuit current: i cc [ma] 105c 25c C 40c operating voltage range 105c 25c C 40c figure 5. output high voltage vs output source current -1.2 -0.9 -0.6 -0.3 0.0 0.0 0.4 0.8 1.2 output source current: i o [a] output high voltage: v oh [v] 16v 12v 5.5v downloaded from: http:///
datasheet d a t a s h e e t 6/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 typical performance curves (reference data) C continued 0.0 0.3 0.6 0.9 1.2 0.0 0.4 0.8 1.2 output sink current: io[a] output low voltage: v ol [v] 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 supply voltage: vcc[v] lock detection on time: t on[s] 8.0 9.0 10.0 11.0 12.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off/on ratio: t ratio [s/s] 16v 12v 5.5v figure 7. output low voltage vs output sink current (ta=25c) figure 8. lock detection on time vs supply voltage figure 9. lock detection off time vs supply voltage 105 25 -40 3.0 4.0 5.0 6.0 7.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off time: t off [s] 105c 25c C 40c 105c 25c C 40c operating voltage range operating voltage range operating voltage range figure 10. lock detection off/on ratio vs supply voltage downloaded from: http:///
datasheet d a t a s h e e t 7/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 typical performance curves (reference data) C continued 0.0 0.2 0.4 0.6 0.8 024681 0 al sink current: i al [ma] al output low voltage: v all [v] 0.0 0.2 0.4 0.6 0.8 024681 0 al sink current: i al [ma] al output low voltage: v all [v] 105c 25c C 40c figure 13. al output voltage vs al sink current (ta=25c) 16v 12v 5.5 v figure 14. al output leak current vs al voltage figure 11. hall input hysteresis voltage vs supply voltage -2 0 2 4 6 8 0 5 10 15 20 al voltage: v al [v] al output leak current: i all [ua] 105c 25c C 40c -40 -20 0 20 40 0 5 10 15 20 supply voltage: vcc[v] hall input hysteresis voltage: v hys [mv] 105c 25c C 40c 105c 25c C 40c operating voltage range operating voltage range figure 12. al output low voltage vs fg sink current (v cc =12v) downloaded from: http:///
datasheet d a t a s h e e t 8/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 typical performance curves (reference data) C continued -50 -40 -30 -20 -10 0 0 5 10 15 20 supply voltage: v cc [v] pwm intput low current: i pwml [ua] -2 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] pwm intput hi current: i pwmh [ua] figure 15. pwm input hi current vs supply voltage 105c 25c C 40c 105c 25c C 40c operating voltage range operating voltage range figure 16. pwm input low current vs supply voltage 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 supply voltage: v cc [v] reference voltage: v ref [v] 105c 25c C 40c figure 17. reference voltage vs supply voltage (i ref =-1ma) 2.0 2.5 3.0 3.5 4.0 0.0 2.5 5.0 7.5 10.0 ref source current: i ref [ma] reference voltage: v ref [v] figure 18. reference vs ref source current (v cc =12v) 16 v 12v 5.5 v operating voltage range downloaded from: http:///
datasheet d a t a s h e e t 9/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 typical performance curves (reference data) C continued 200 250 300 350 400 0 5 10 15 20 supply voltage: v cc [v] current limit setting voltage: v cl [mv] 105c 25c C 40c figure 19. current limit setting voltage vs supply voltage operating voltage range figure 20. la input hi current vs supply voltage 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] la input hi current:i lah [ua] 105c 25c C 40c operating voltage range -0.8 -0.6 -0.4 -0.2 0.0 0 5 10 15 20 supply voltage: v cc [v] la input low current: i lal [ma] 105c 25c C 40c figure 21. la input low current vs supply voltage -4 -3 -2 -1 0 1 0 5 10 15 20 supply voltage: v cc [v] cs bias current: i cs [ua] 16 v 12v 5.5 v operating voltage range figure 22. cs input bias current vs supply voltage operating voltage range downloaded from: http:///
datasheet d a t a s h e e t 10/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 application information application circuit examples (constant values are for reference) 1. pwm input application this is an example of the application of inverting the external pwm input, and controlling the rotational speed. in this application, minimum rotational speed can be set. application design note (a) the bypass capacitor connected must be more than the recommended constant value because there is a possibility of the motor start-up failu re etc. due to ic malfunction. substrate design note (a) ic power (v cc ), motor outputs (out1, 2), and motor ground lines are made as wide as possible. (b) ic ground (gnd) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (C) land. (c) the bypass capacitor and/or zener diode are placed near to vcc pin. (d) h+ and hC lines are arranged side by side and made from the hall element to ic as short as possible, because it is easy for the noise to influence the hall lines. figure 23. pwm input application reverse polarity protection protection against back emf maximum output voltage and current are 18v and 1.2a respectively. connect bypass capacitor near vcc terminal as much as possible soft switching setting minimum duty setting stabilization of ref voltage recirculate setting hall bias is set according to the amplitude of hall element output and hall input voltage range. protection for al (open-drain) to limit motor current, the current is detected. note the power consumption of sense resistance. noise measures of substrate low-pass filter for rotation speed instruction input i/o duty slope setting linearization correction resistance lead angle setting pwm m h pwm la out2 h+ h- out1 vcc min lz slope tsd control logic osc filter ref refe- rence rnf pre- driver soft cs inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 sig al signal output 1 gnd 16 to 1k ? 0.22 ? to 1 f to 0.1 f to 1k ? to 100k ? + - comp comp - vcl + inside reg downloaded from: http:///
datasheet d a t a s h e e t 11/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 2. dc voltage input application this is an example application circuit for fixed rotation speed control by dc voltage. in this application, minimum rotational speed cannot be set. figure 24. dc voltage input application pull-down pwm terminal to gnd zener diode for min withstand voltage protection dc m h pwm la out2 h+ h- out1 vcc min lz slope tsd control logic osc filter ref refe- rence rnf pre- driver soft cs inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 sig al signal output 1 gnd 16 to 1k ? 0.22 ? to 1 f to 0.1 f to 1k ? to 100k ? 0 ? + - comp comp - v cl + 0 ? inside reg downloaded from: http:///
datasheet d a t a s h e e t 12/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 functional descriptions 1. variable speed operation the rotational speed of the motor changes by the pwm duty of the motor outputs (out1 and out2 terminals). however, it provides for the motor's output not by the rotational speed but by the duty in the BD61241FV, because the rotational speed is not uniquely decided by the motor output duty. the changeable speed operation is controlled by these two input terminals. (1) pwm operation by pulse input in pwm terminal (2) pwm operation by dc input in min terminal (note) pwm frequency of output is 50khz (typ). hence, in put pwm frequency is not equal to pwm frequency of output. (1) pwm operation by pulse input in pwm terminal the pwm signal from the controller can be input directly to ic in figure 25. the output duty is controlled by the input pwm duty (figure 26). refer to recommended operating conditions (p.3) and electrical characteristics (p.4) for the input condition. internal power-supply voltage (internal reg; typ 5.0v) is impressed when the pwm terminal is open, it becomes 100% input of the duty and equivalent, and a full torque is driven. there must be a pull-down resistance outside of ic to make it to torque 0 when the pwm terminal opens (however, only at the controller of the complimentary output type.). insert the protective resistance and capacitor for noise removal if necessary. full torque (v pwm >2.5v) and zero torque (v pwm <1.0v) can recognize the dc voltage input of the pwm terminal. however, the variable speed control in the dc voltage between 0v and 5.0v should be not able to be done. (a) setting of minimum output duty (min) minimum rotational speed can be set by min terminal in figure 27. the resolution of the min terminal is 128 steps. min terminal should be shorted to gnd when this function is not used. figure 25. pwm input application min ref setting v oltage division o f resistance (min enable) ok min ref setting of resistance pull-down (min disable) ok figure 29. min terminal setting min ref ng open setting (prohibit input) pwm input on duty [%] out1, 2 outputs on duty [%] 100 100 0 a min setting 0.1 0r e f 5 minimum output duty setting (128 steps) 100 min input voltage [v] output minimum duty [%] 1 30 pwm protection resistor motor unit driver pwm filter inside reg controller pull-down resistor complimen -tary output capacitor for noise removal min ref setting of resistance pull-up (full torque) ok figure 26. pwm input operation timing chart inside reg out1 pwm 5.0v 1.0v 2.5v out2 low high low high low high h+ hC 0.0v gnd zero full motor torque : high impedance motor output on figure 27. setting of minimum output duty figure 28. relation of min input voltage and output duty downloaded from: http:///
datasheet d a t a s h e e t 13/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 (b) setting of slope of i/o duty (slope) slope of output duty and the input duty to pwm terminal can be established by slope setting in figure 30. the resolution of min is 128 steps. but if the voltage of the slope terminal is 0.4v to 0.825v (typ), then the slope of the input and output duty is fixed to 0.5, and if it is less than 0.4v (typ) the slope is fixed to 1 (figure 31). slope terminal should be shorted to gnd when this function is not used. (2) pwm operation by dc input in min terminal the output duty can be varied by inputting dc voltage into min terminal. pwm terminal should be shorted to gnd when this function is used. please refer to input voltage range 1(p.3) for the input condition of the min terminal. min terminal voltage becomes unsettled when min terminal is in an open state. the voltage of the terminal becomes irregular if min terminal is open. input voltages to min terminals when you turn on ic power supply (v cc ) in figure 32. *in the case of dc voltage input, it cannot set the lowest output duty. (a) setting of slope of i/o duty (slope) slope of output duty and the input voltage to min terminal can be established by slope setting in figure 35. the resolution of slope is 128 steps. but if the voltage of the slope terminal is 0.4v to 0.825v (typ), then the slope of the input and output duty is fixed to 0.5, and if it is less than 0.4v (typ) the slope is fixed to 1 (figure 31). slope terminal should be shorted to gnd when this function is not used. ref min 3.3v 0% 100% low high h+ hC 0.0v gnd zero full m o t o r t o r q u e out2 duty out1 low : high impedance m o t o r o u t p u t on high figure 33. dc input application figure 34. dc input operation timing chart figure 30. adjust of slope of i/o duty pwm input on duty [%] out1, 2 outputs on duty [%] 100 100 0 a slope setting slope=2 slope=0.5 0.825 0 ref 0.5 i/o duty slope setting (128 steps) 2 slope input voltage [v] slope 1 1.5 1.65 2.5 0.4 figure 31. relation of slope voltage and slope of i/o duty slope ref setting v oltage division o f resistance (slope enable) ok slope ref setting of resistance pull-down (slope = 1) ok slope ref ng open setting (prohibit input) figure 32. slope terminal setting figure 35. relation of min input voltage and slope of i/o duty min [v] out1, 2 outputs on duty [%] ref 100 0 a slopesetting slope=2 slope=0.5 slope ref setting of resistance pull-up (slope=2) ok min pwm filter inside reg dc 200k ? (typ) zener diode for min withstand voltage protection downloaded from: http:///
datasheet d a t a s h e e t 14/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 2. about setting of phase switching of output the period of soft switching and recirculate can be adjusted by soft and lz setting. (1) soft switching period setting (soft) the soft switching section in the output can be set by soft terminal. by adjusting soft voltage, soft switching section can be set from 22.5 to 90 as one period of hall signal 360. the resolution of soft is 128 steps in figure 37. timing chart is shown in figure 36. *a soft switching period is the section where on duty of the output changes from a target duty into 0% by 16 steps. h+ hC low high low high motor current 0a out1 out2 adjust a soft switching period by soft setting setable range min=22.5 to max=90 one period of hall signal 360 soft switching period (max 90) figure 36. soft switching period setting 0.825 0 ref 22.5 set of soft switching period (128 steps) 90 soft input voltage [v] 45 67.5 1.65 2.5 angle[] figure 37. relation of soft input voltage and soft switching period soft ref setting v oltage division o f resistance (soft enable) ok soft ref setting of resistance pull-down (soft min 22.5) ok figure 38. soft terminal setting soft ref ng open setting (prohibit input) soft ref setting of resistance pull-up (soft max 90 ) ok downloaded from: http:///
datasheet d a t a s h e e t 15/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 (2) recirculate period setting (lz) the recirculate period in fall of the output can be set by lz terminal. by adjusting lz voltage, recirculate period can be set from 0 to 90 as one period of hall si gnal 360 in figure 40. the resolution of lz is 128 steps. timing chart is shown in figure 39. about priority of soft and lz setting, the setting priority of the period to recirculate than a soft switching period is high. for example, v soft =1.65v, v lz = 0.825v soft switching period = (1.65/3.3)*90 - (0.825/3.3)*90=45-22.5=22.5 recirculate period = (0.825/3.3)*90=22.5 when you set a period to recirculate for longer than soft switching period, a soft switching section for 5.6 (typ) enters. * a recirculate period is a current recirculate period before phase switching of output. in the recirculate period, the logic of the output transistor is decided by the hall input logic. the phase of output hi becomes the high impedance, and the phase of output low is low. figure 39. recirculate period setting 0.825 0 ref 22.5 set of re-circulate period (128 steps) 90 lz input voltage [v] 45 67.5 1.65 2.5 angle[] figure 40. relation of lz input voltage and recirculate period h+ hC low high low high motor current 0a out1 out2 adjust a re-circulate period by lz setting setable range min22.5 to max90 one period of hall signal 360 soft switching period re-circulate period(max 90) figure 41. lz terminal setting lz ref setting v oltage division o f resistance (lz enable) ok lz ref setting of resistance pull-down (lz min 0) ok lz ref ng open setting (prohibit input) lz ref setting of resistance pull-up (lz max 90) ok downloaded from: http:///
datasheet d a t a s h e e t 16/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 (3) function of lead angle setting (la) this function automatically detects a current phase gap, and an aspect change point is revised to lead angle. when a current phase is delayed for a hall phase, output phase can be changed up to 22.5 automatically. when you use the lead angle function, please set the la terminal open. when you are not using the lead angle function, please connect la terminal to gnd. timing chart is shown in figure 42 and 43. h+ hC low high low high motor current 0a out1 out2 set of soft switching period; 40 lead angle none kickback restraint; none set of re-circulate period; 0 one period of hall signal 360 set of soft switching period; 40 kickback restraint; available set of re-circulate period; 0 one period of hall signal 360 lead angle max 22.5 figure 42. lead angle function disable figure 43. lead angle function enable la ref setting of resistance pull-down (lead angle function disable) ok figure 44. la terminal setting la ref open setting (lead angle function enable) ok downloaded from: http:///
datasheet d a t a s h e e t 17/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 3. current limit the current limit circuit turns off the output when the current that flows to the motor coil is detected exceeding a set value. the current value that current limit operates is determined by internal setting voltage and cs terminal. in figure 46, i out is the current flowed to the motor coil, r nf is the resistance detecting the current, and p rmax is the power when you use the current limit function, please c onnect the cs terminal and the rnf terminal. when you are not using the current limit function, please connect the cs terminal to gnd. 4. lock protection and automatic restart motor rotation is detected by hall signal, and the ic internal counter set lock detection on time (t on ) and off time (t off ). timing chart is shown in figure 47. t off (typ 5.0s) low high : high impedance out1 low high low high h+ hC 0% motor output on duty out2 al low high t on (typ 0.5s) t on t off motor lock lock detection motor lock release motor idling t on t off instruction to r q u e figure 47. lock protection (incorporated counter system) timing chart figure 46. setting of current limit and ground lines current limit comp gnd motor ground line r nf ic signal ground line cs vcl out1 out2 rnf io m connect to rnf (current limit enable) ok cs rnf setting of resistance pull-down (current limit disable) ok cs rnf cs ng open setting (prohibit input). figure 45. cs terminal setting io[a] = v cl [v] / r nf [ ? ] = 265[mv] / 0.33[ ? ] = 0.803[a] p rmax [w] = v cl [v] x io[a] = 265[mv] x 0.803[a] = 0.213[w] downloaded from: http:///
datasheet d a t a s h e e t 18/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 5. quick start when torque off logic is input by the control signal over a fixed time, the lock protection function is disabled. the motor can restart quickly once the control signal is applied. 6. start duty assist start duty assist can secure a constant starting torque even at low duty. the ic is driven by a constant output duty (d ohl ; typ 50%) within detection of motor rotation. when output on duty is less than 50% (typ), start duty assist function operates under the following conditions: (1) power on (2) lock release (3) quick start (4) thermal shut down(tsd) release figure 48. quick start timing chart (pwm input application) disable enable pwm low high low high h+ hC 0% under 5ms(typ) torque off motor stop torque on lock protection signal motor idling pwm or min torque motor output on duty quick start standby mode off on 0% pwm or mi n torque motor output on duty duty assist power on :start duty assist d ohl (typ 50%) power detect of motor rotation 100% figure 50. timing chart of power on 150c 175c 0% duty assist tsd on d ohl (typ 50%) off motor output on duty junction temperature :start duty assist 100% pwm or mi n torque detect of motor rotation figure 51. timing chart of tsd release figure 49. i/o duty characteristic in start duty assist motor output on duty[%] 100 0 50 100 pwm duty [ % ] p oh 50 d ohl ; typ 50% downloaded from: http:///
datasheet d a t a s h e e t 19/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 7. hall input setting hall input voltage range is shown in operating conditions (p.3). adjust the value of hall element bias resistor r 1 ,r 2 in figure 53 so that the input voltage of a hall amplifier is input in "input voltage range 1"(p.3) including signal amplitude. r 2 is resistance to correct the temperature characteristic of the hall element. reducing the noise of hall signal v cc noise or the like depending on the wiring pattern of board may affect hall element. in this case, place a capacitor like c 1 in figure 56. in addition, when wiring from the hall element output to ic hall input is long, noise may be induced on wiring. in this case, place a capacitor like c 2 . 8. high-speed detection protection high-speed detection protection begins lock protection acti on when it detects that the hall input signal is in an abnormal state (more than typ 2.5khz). noise may be induced on wiring. in this case, place a capacitor like c 2 in figure 53. ref h+ hall c 1 c 2 r 2 r 1 r h v h i h hall bias current; i h [a] = v ref [v] / (r 1 +r 2 //r h )[ ? ] hall bias voltage; v h [v] = v ref [v] x (r 2 //r h ) / (r 1 +r 2 //r h )[ ? ] refe- rence hC comp - + figure 53. hall input application 0v hall input upper limit h+ hC operating hall input voltage range hall input lower limit h+ hC v ref +0.3v figure 52. hall input voltage range downloaded from: http:///
datasheet d a t a s h e e t 20/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 safety measure 1. reverse connection protection diode reverse connection of power results in ic destruction as shown in figure 54. when reverse connection is possible, reverse connection protection diode must be added between power supply and vcc. 2. protection against v cc voltage rise by back electromotive force back electromotive force (back emf) generates regenerative current to power supply. however, when reverse connection protection diode is connected, v cc voltage rises because the diode prevents current flow to power supply. when the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (a) capacitor or (b) zener diode between vcc and gnd. if necessary, add both (c). 3. problem of gnd line pwm switching do not perform pwm switching of gnd line because gnd terminal potential cannot be kept to a minimum. 4. lock alarm signal (al) open-drain output al output is an open drain and requires pull-up resistor. addi ng resistor can protect the ic. exceeding the absolute maximum rating, when al terminal is directly connected to power supply, could damage the ic. figure 54. flow of current when power is connected reversely figure 55. v cc voltage rise by back electromotive force figure 56. measure against v cc and motor driving outputs voltage figure 57. gnd line pwm switching prohibited figure 58. protection of al terminal i/o vcc gnd in normal energization internal circuit impedance is high ? am p era g e small circuit block i/o gnd reverse power connection large current flows ? thermal destruction circuit block vcc i/o gnd after reverse connection destruction prevention no destruction circuit block vcc on phase switching on on on o n on o n on o n on (a) capacitor (b) zenner diode (c) capacitor & zenner diode vcc gnd prohibit motor driver controller pwm input m al driver protection resistor motor unit pull-up resisto r sig connector downloaded from: http:///
datasheet d a t a s h e e t 21/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 power consumption 1. current pathway the current pathways that relates to driver ic are the following. (1) circuit current (i cc ) (2) motor current (i m ) (3) reference bias current to the resistors (i ref ) (4) al output sink current (i al ) 2. calculation of power consumption (1) circuit current (i cc ) p wa [w] = v cc [v] x i cc [a] (i cc current doesnt include i m ,i ref ) (ex.) v cc = 11.3[v], i cc = 4.5[ma] p wa [w] = 11.3[v] x 4.5[ma] = 50.85 [mw] (2) motor driving current (i m ) v oh is the output saturation voltage of out1 or out2 high side, v ol is the other low side voltage, p wb [w] = (v oh [v] + v ol [v]) x i m [a] (ex.) v oh = 0.10[v], v ol = 0.10[v], i m = 200[ma] p wb [w] = (0.10[v] + 0.10[v]) x 200[ma] = 40.0[mw] (3) reference bias current to the lpf and resistors (i ref ) p wc [w] = (v cc [v] C v ref [v]) x i ref [a] (ex.) i ref = 6.0[ma] p wc [w] = (11.3[v] C 3.3[v]) x 6.0[ma] = 48.0[mw] (4) al output sink current (i al ) p wd [w] = v al [v] x i al [a] (ex.) v al = 0.10[v], i al = 5.0[ma] p wd [w] = 0.10[v] x 5.0[ma] = 0.5[mw] total power consumption of driver ic becomes the following by the above (1) to (4). p wttl [w] = p wa [w] + p wb [w] + p wc [w] + p wd [w] (ex.) p wttl [w] = 50.85[mw] + 40.0[mw] + 48.0[mw] + 0.5[mw] = 139.35[mw] refer to next page when you calculate the chip surface temperature (tj) and the package surface temperature (tc) by using the power consumption value. figure 59. current pathway of ic pwm m h pwm la out2 h+ h- out1 vcc min lz slope tsd control logic osc filter ref refe- rence rnf pre- driver soft cs inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 sig al signal output 1 gnd 16 i al i ref i m i cc + - comp comp + - v cl inside reg downloaded from: http:///
datasheet d a t a s h e e t 22/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 power dissipation 1. power dissipation power dissipation (total loss) indicates the power that can be consumed by ic at ta=25c (normal temperature). ic is heated when it consumes power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be accepted by ic chip into the package, that is junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, etc. power dissipation is determined by this maximum joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature. therefore, when a power dissipation that provides by the absolute maximum rating is exceeded, the operating temperature range is not a guarantee. the maximum junction temperature is in general equal to the maximum value in the storage temperature range. c/w] [p/ ta) -tj(=ja 2. thermal resistance heat generated by consumed power of ic is radiated from the mold resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. in the state of the substrate mounting, thermal resistances from the chip junction to the ambience and to the package surface are shown respectively with ja [c/w] and jc [c/w]. thermal resistance is classified into the package part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. on the other hand, thermal re sistance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the copper foil area etc. therefore, thermal resistance can be decreased by the heat radiation measures like inst alling a heat sink etc. in the mounting substrate. the thermal resistance model and calculations are shown in figure 61. (note) reduce by 7.0mw/c when operating over ta=25c (mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board) ja = (tj C ta) / p [c/w] figure 60. thermal resistance model of surface mount figure 61. power dissipation vs ambient temperature chip surface temperature tj[c] package surface temperature tc[c] power consumptio n p[w] ambient temperature ta[c] 0.50 0.75 pd[w] 0 25 50 75 100 125 150 ta [ c ] 0.25 0.87 ja=142.9 [c/w] 105 downloaded from: http:///
datasheet d a t a s h e e t 23/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 i/o equivalent circuit (resistance values are typical) 1. power supply terminal 2. pwm input 3. output current 4. hall +/- input 5. reference voltage round terminal duty terminal detecting terminal terminal output terminal 6. lead angle function 7. i/o duty slope setting terminal 8. motor output 9. lock alarm signal select terminal minimum output duty setting t erminal 1/2 output terminal terminal, recirculate period output current detecting setting terminal and soft switching resistor connecting terminal setting terminal vcc gnd slope min lz soft ref vcc al vcc out1 out2 rnf cs vcc pwm inside reg inside reg 2 0 0k ? ( t yp) la inside reg 10k ? (typ) 1k ? h+ hC downloaded from: http:///
datasheet d a t a s h e e t 24/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the syst em to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the power dissipation stated in this datasheet is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to raise heat dissipation capability. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give spec ial consideration to power co upling capacitance, width of power and ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. to prevent damage from static discharge, ground the ic during assembly and use si milar precautions during transport and storage. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. 10. mounting errors and inter-pin short ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet d a t a s h e e t 25/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gat e has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. especially, if it is not expressed on the datasheet, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown (tsd) circuit this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature will rise which will activate the tsd circuit that will turn off all output pins. when the junction temperature falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. figure 62. example of monolithic ic structure downloaded from: http:///
datasheet d a t a s h e e t 26/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name ssop-b16 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 27/27 BD61241FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0h1h0b101570-1-2 16.oct.2015 rev.001 tsz22111 ? 15 ? 001 ordering information marking diagram revision history date revision changes 16.oct.2015 rev.001 new release 61241 ssop-b16 (top view) part number lot number 1pin mark b d 6 1 4 1 f e part number package ? fv; ssop-b16 v ? g: halogen free packaging and forming specification - 2 2 g ? e2: embossed ta p e and reel downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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